ELECTRICALLY INSULATING THERMALLY CONDUCTIVE POLYMER RESIN COMPOSITION BASED ON STYRENICS WITH BALANCED PROPERTIES

Thermally conductive polymer (TCP) resin composition (i) or (ii) are described, comprising components (I) and (II): (i) 40 to 72% by volume of at least one matrix polymer (I); 28 to 60% by volume of a thermally conductive filler material (II) (D50 0.1 to 200 μm) consisting of aluminosilicate (II-1)...

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Bibliographische Detailangaben
Hauptverfasser: NIESSNER, Norbert, MICHAELIS DE VASCONCELLOS, Janna, SCHMIDT, Hans-Werner, MICHELS, Gisbert, KOLB, Tristan, WIEBERGER, Florian, SCHULZ, Tobias
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Thermally conductive polymer (TCP) resin composition (i) or (ii) are described, comprising components (I) and (II): (i) 40 to 72% by volume of at least one matrix polymer (I); 28 to 60% by volume of a thermally conductive filler material (II) (D50 0.1 to 200 μm) consisting of aluminosilicate (II-1) in combination with a further component (II-2) selected from: multi wall carbon nanotubes, graphite and and boron nitride, wherein the volume ratio (ll-1)/(ll-2) is 30:1 to 0.1:1; or (ii) 40 to 65% by volume of at least one matrix polymer (I); 35 to 60% by volume of aluminosilicate (II) (D50 0.1 to 200 μm); wherein the matrix polymer (I) comprises styrenic polymers (I′) selected from: ABS resins, ASA resins, and elastomeric block copolymers. Shaped articles made thereof can be used as "Cool Touch" surfaces for automobile interior, motor housings, lamp housings and electrical and electronic housings and as heat sinks for high performance electronics or LED sockets.