ALUMINIUM COMPOUNDS MATERIAL FOR USE IN THERMAL FLUXLESS JOINING METHOD AND METHOD FOR PRODUCING THE SAME

Provided are embodiments of an aluminium composite material for use in thermal flux-free joining methods. The composite material has at least one core layer of an aluminium core alloy and at least one outer solder layer of an aluminium solder alloy. The aluminium solder alloy has the following compo...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ECKHARD, Kathrin, RICHTER, Thorsten, EIGEN, Nico, GÜßGEN, Olaf, JANSSEN, Hartmut
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided are embodiments of an aluminium composite material for use in thermal flux-free joining methods. The composite material has at least one core layer of an aluminium core alloy and at least one outer solder layer of an aluminium solder alloy. The aluminium solder alloy has the following composition in wt %: 6.5%≤Si≤13%, Fe≤1%, 230 ppm≤Mg≤450 ppm, Bi≤500 ppm, Mn≤0.15%, Cu≤0.3%, Zn≤3%, and Ti≤0.30% with the remainder Al and unavoidable impurities individually at most 0.05%, in total at most 0.15% and the aluminium solder layer has an alkaline pickled or acid pickled surface. The invention further relates to a method for producing an aluminium composite material, a method for the thermal joining of components, and a thermally joined construction.