SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

It is possible to prevent deterioration of a redistribution layer due to exposure of the redistribution layer from an upper insulating film and the resultant reaction with moisture, ions, or the like. As means thereof, in a semiconductor device having a plurality of wiring layers formed in an elemen...

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Bibliographische Detailangaben
Hauptverfasser: MATSUMOTO, Masahiro, YAJIMA, Akira, ICHINOSE, Kazuhito
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:It is possible to prevent deterioration of a redistribution layer due to exposure of the redistribution layer from an upper insulating film and the resultant reaction with moisture, ions, or the like. As means thereof, in a semiconductor device having a plurality of wiring layers formed in an element formation region and having a redistribution layer connected with a pad electrode which is an uppermost wiring layer, a dummy pattern is arranged in a region closer to a scribe region than the redistribution layer.