DYNAMIC QUANTITY MEASURING APPARATUS

The purpose of the present invention is to provide a strain sensor module structure having exceptional strain measurement accuracy and suppressing sensor output variation caused by moisture absorbed by a plastic member used as an electrical wiring member, etc., in a strain sensor module. The dynamic quantity measuring apparatus is characterized in having a strain sensor formed by a plurality of piezoelectric resistance elements and electrode pads on the surface of a semiconductor substrate, an electrical wiring plastic member provided with a plurality of wires that electrically connect to the plurality of electrode pads, a strain body joined to the rear surface of the strain sensor, and a bonding part via which the electrical wiring plastic member and strain body are affixed together; a groove being provided in an area of the electrical wiring plastic body that is near the strain sensor.