CARD SUBSTRATE LAMINATING DEVICE AND METHOD

A card substrate laminating device including a transfer roller configured to heat a portion of a transfer layer of a transfer ribbon and transfer the portion of the transfer layer from a carrier layer of the transfer ribbon to a surface of a card substrate. The transfer roller includes a diameter of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SKOGLUND, John, WOIZESCHKE, Michael, SNYDER, Tanya, HOFFMAN, Ted
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:A card substrate laminating device including a transfer roller configured to heat a portion of a transfer layer of a transfer ribbon and transfer the portion of the transfer layer from a carrier layer of the transfer ribbon to a surface of a card substrate. The transfer roller includes a diameter of less than 0.537 inches and a compliant exterior surface layer or coating. The compliant exterior surface layer or coating can include silicon rubber. The compliant exterior surface layer or coating can be approximately 0.020 inches thick. An internal heating element is configured to heat the transfer roller from an ambient temperature to a laminating temperature, at which laminating operations are performed, within 40 seconds.