EFFICIENT HEAT REMOVAL FROM COMPONENT CARRIER WITH EMBEDDED DIODE

A component carrier (100) which comprises an interconnected stack (102) comprising at least one electrically insulating layer structure (104) and/or at least one electrically conductive layer structure (106), a component (108) embedded in the stack (102) and comprising a diode (110), and at least on...

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Bibliographische Detailangaben
Hauptverfasser:	Weis, Gerald, Morianz, Mike, Stahr, Johannes
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A component carrier (100) which comprises an interconnected stack (102) comprising at least one electrically insulating layer structure (104) and/or at least one electrically conductive layer structure (106), a component (108) embedded in the stack (102) and comprising a diode (110), and at least one heat removal layer (112, 118) configured for removing heat from the diode (110) and substantially fully covering a whole main surface of the component carrier (100).