COOLING ARRANGEMENT FOR AN ELECTRONIC COMPONENT

The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a he...

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Bibliographische Detailangaben
Hauptverfasser:	KNOFE, Rüdiger, FRANKE, Martin, WITTREICH, Ulrich, NIEDERMAYER, Michael, MÜLLER, Bernd, NERRETER, Stefan, FRÜHAUF, Peter, ZÄSKE, Manfred
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present disclosure relates to a cooling arrangement for an electronic component. Some embodiments of the teachings thereof may include a heat sink with a contact surface as an interface for the electronic component. For example, a cooling arrangement for an electronic component may include: a heat sink with a contact surface for the electronic component; a converter for the conversion of thermal energy into useful energy; a functional element driven by the useful energy; and an active cooling device for the heat sink or for the electronic component.