POLYOLEFIN HOT MELT ADHESIVE WITH LOW REACTIVATION TEMPERATURE AND HIGH TEMPERATURE RESISTANCE AND ITS USE FOR VACUUM DEEP DRAW LAMINATING

A hot-melt glue composition, including a) at least one atactic poly-α-olefin (APAO) that is solid at 25° C.; b) at least one hydrocarbon resin having a softening point of at least 80° C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydr...

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Bibliographische Detailangaben
Hauptverfasser: URBACH, Dirk, JANKE, Doreen, PASCHKOWSKI, Kai, CORDES, Mathias
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A hot-melt glue composition, including a) at least one atactic poly-α-olefin (APAO) that is solid at 25° C.; b) at least one hydrocarbon resin having a softening point of at least 80° C., measured in accordance with the ring-and-ball method according to DIN EN 1238; and c) at least one maleic-anhydride-grafted wax having a softening point of not more than 150° C., measured in accordance with the ring-and-ball method according to DIN EN 1238, which is a maleic-anhydride-grafted polypropylene wax or a maleic-anhydride-grafted polyethylene wax, wherein the proportion of the at least one maleic-anhydride-grafted wax in the hot-melt glue composition is at least 3 wt %. The hot-melt glue composition is characterized by a low reactivation temperature, together with high heat resistance and good adhesion to ABS and nonpolar polyolefin materials. The hot-melt glue composition is well suited for film lamination by vacuum deep-drawing lamination, in particular for applications in automobile construction.