HEAD MODULE AND LIQUID EJECTION APPARATUS

A head module 10m includes a head 11, a pair of driver ICs 12, a holder 13 that supports the head 11, a head spreader 14 in thermal communication with the pair of the driver ICs 12 and a heat insulator 15 located between the heat spreader 14 and the holder 15. The heat insulator 15 has a thermal con...

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Bibliographische Detailangaben
1. Verfasser:	SAKUMA, Susumu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS
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Beschreibung
Zusammenfassung:	A head module 10m includes a head 11, a pair of driver ICs 12, a holder 13 that supports the head 11, a head spreader 14 in thermal communication with the pair of the driver ICs 12 and a heat insulator 15 located between the heat spreader 14 and the holder 15. The heat insulator 15 has a thermal conductivity lower than the heat spreader 14.