CURABLE COMPOSITION AND CURED PRODUCT FROM SAME

Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition is a curable composition for production of an optical component by molding...

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Bibliographische Detailangaben
Hauptverfasser:	FUJIKAWA, Takeshi, FUKUI, Sadayuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PHYSICS PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Provided is a curable composition which has excellent curability, less causes silicone molds to swell, and allows the silicone molds to have better durability and a longer service life in repeated use. The curable composition is a curable composition for production of an optical component by molding using silicone molds. The curable composition contains curable compounds and a cationic initiator. The curable compounds include (A) a cycloaliphatic epoxy compound and (B) an oxetane compound. The oxetane compound (B) is present in a content of 10 to 45 weight percent of the totality of all the curable compounds contained in the curable composition. Of the totality of all the curable compounds contained in the curable composition, 90 weight percent or more is a compound or compounds having a solubility parameter of 9.0 (cal / cm 3 ) 1/2 or more as determined at 25°C by the Fedors' method. The curable composition has an average solubility parameter of all the curable compounds contained in the curable composition of 9.55 to 10.30 (cal / cm 3 ) 1/2 as determined at 25°C by the Fedors' method.