BONDING MATERIAL, BONDED BODY OBTAINED BY THE SAME, AND MANUFACTURING METHOD OF BONDED BODY

A bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which may form a compound along with tin and carbon, and Sn as the main component of a remainder.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SAKAGUCHI, Shigeki, KITAURA, Hidetoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A bonding material includes at least 0.1 wt% to at most 5 wt% of at least one element which may form a compound along with tin and carbon, and Sn as the main component of a remainder.