HIGH-FREQUENCY MODULE

[Object] To provide a high-frequency module having high reliability. [Solution] The high-frequency module includes a wiring substrate 10, a high-frequency circuit 11 including circuit components 15 disposed on the upper surface of the wiring substrate 10, a post 17 disposed on the upper surface of t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKAGAWA, Masashi, SHIBUYA, Yoshihisa, KUWANA, Shunji, WATANABE, Hideki, KAI, Shoji
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:[Object] To provide a high-frequency module having high reliability. [Solution] The high-frequency module includes a wiring substrate 10, a high-frequency circuit 11 including circuit components 15 disposed on the upper surface of the wiring substrate 10, a post 17 disposed on the upper surface of the wiring substrate 10 and made of a metal, a sealing resin 30 covering the circuit components 15, and an antenna substrate 20 disposed on the upper surface of the sealing resin 30 and having an antenna 21 formed by a metal pattern 21a. A groove 31 is provided on the sealing resin 30, at least a part of the post 17 is exposed from the groove 31, a central surface 17a and two opposing side wall surfaces 17b located higher than the central surface 17a are formed at the upper side of the post 17, and a conductive adhesive 13 is bonded to the central surface 17a, the two side wall surfaces 17b, and the antenna 21.