POWDER COATING APPARATUS

An object of the present invention is to provide a powder coating apparatus which can form a thin film in which freely selected elements are combined without an impurity being mixed and satisfies that a composition of the obtained thin film is uniform. The powder coating apparatus according to the p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MARUKO, Tomohiro, JINUSHI, Keiichiro, ITO, Amiko
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An object of the present invention is to provide a powder coating apparatus which can form a thin film in which freely selected elements are combined without an impurity being mixed and satisfies that a composition of the obtained thin film is uniform. The powder coating apparatus according to the present invention is a powder coating apparatus 100 including a barrel 3, exhaust means 4 for evacuating an inside of the barrel, and a sputtering device 2 installed inside the barrel, the barrel having a main axis C directed in a horizontal direction and rotating around the main axis, the sputtering device forming a coating film on a surface of powder 7 put in the barrel, in which the sputtering device has one fixing portion 10 for one target to mount two or more targets 6, and respective targets are disposed in parallel to each other at the same level position with respect to a direction of the main axis when the target is mounted on the fixing portion.