THERMALLY CONDUCTIVE COMPOSITION, SEMICONDUCTOR DEVICE, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR BONDING HEAT SINK PLATE

A thermally conductive composition of the present invention contains metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, wherein the metal particles (A) form a particle coupling structure by being sintered through a thermal treatment, the metal particles (...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMOBE Yasuo, SAITOH Keiichiro, MURAYAMA Ryuichi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A thermally conductive composition of the present invention contains metal particles (A) and a dispersion medium (B) in which the metal particles (A) are dispersed, wherein the metal particles (A) form a particle coupling structure by being sintered through a thermal treatment, the metal particles (A) have a particle size D 50 at 50% in a volume-based cumulative distribution of equal to or greater than 0.8 µm and equal to or smaller than 5 pm, and the metal particles (A) have a standard deviation of the particle size of equal to or less than 2.0 µm.