POSTAGE STAMPS

The present invention relates to the field of cold transfer postage stamps for mail pieces (0), methods for manufacturing said postage stamps and uses thereof. In particular, it relates to cold transfer postage stamps comprising a first release coated substrate (1), one or more printed layers (2) co...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WOOD, Richard, Lewis, FRYER, Andrew
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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Beschreibung
Zusammenfassung:The present invention relates to the field of cold transfer postage stamps for mail pieces (0), methods for manufacturing said postage stamps and uses thereof. In particular, it relates to cold transfer postage stamps comprising a first release coated substrate (1), one or more printed layers (2) comprising one or more security features (6), a white opaque printed layer (3), a pressure sensitive adhesive layer (4), and a second release coated substrate (5).