MULTILAYER ELECTRONIC MODULE, IN PARTICULAR FOR A CONTACTLESS CHIP CARD

The invention relates to an electronic module for a portable object communicating by means of radiofrequency, in particular for a contactless chip card. Said electronic module comprises: a first substrate (S1) to which a microelectronic chip () is attached, and a first antenna connected to said chip...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TEBOUL, Deborah, CALVAS, Bernard, MEAR, Benjamin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS
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Beschreibung
Zusammenfassung:	The invention relates to an electronic module for a portable object communicating by means of radiofrequency, in particular for a contactless chip card. Said electronic module comprises: a first substrate (S1) to which a microelectronic chip () is attached, and a first antenna connected to said chip and formed by a plurality of coils surrounding said microelectronic chip, characterized in that it comprises a second substrate (S2) provided with a second antenna, said second substrate being placed on top of the first substrate.