ADHESIVE COMPOSITION, IN PARTICULAR FOR ENCAPSULATING AN ELECTRONIC ARRANGEMENT

The invention relates to an adhesive composition, preferably pressure-sensitive adhesive composition, comprising a) at least one (co)polymer containing at least isobutylene and/or butylene as comonomer type and, optionally but preferably, at least one comonomer type that-when considered in hypotheti...

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Bibliographische Detailangaben
Hauptverfasser:	KRAWINKEL, Thorsten, DOLLASE, Thilo, GARGIULO, Jessika, KEITE-TELGENBÜSCHER, Klaus, SCHUH, Christian
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention relates to an adhesive composition, preferably pressure-sensitive adhesive composition, comprising a) at least one (co)polymer containing at least isobutylene and/or butylene as comonomer type and, optionally but preferably, at least one comonomer type that-when considered in hypothetical homopolymer form-has a softening point above 40° C., b) at least one type of at least partially hydrogenated adhesive resin, c) at least one type of reactive resin based on a cyclic ether with a softening point below 40° C., preferably below 20° C., d) at least one type of latently reactive thermally activatable initiator for initiating cationic curing.