ULTRATHIN BARRIER LAMINATES AND DEVICES

ULTRATHIN BARRIER LAMINATES AND DEVICES

Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplast...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JOHNSON, Stephen A, MAKI, Stephen P, SPAGNOLA, Joseph C, ROWE, David J, YU, Ta-Hua, LINDQUIST, Timothy J, JONES, Scott J, HAGEN, Kevin D, MC-CORMICK, Fred B, NEAVIN, Terence D, MEVISSEN, Andrew M, LYONS, Christopher S, ROEHRIG, Mark A, LOONEY, Kenneth L
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Beschreibung
Zusammenfassung:Barrier assemblies including ultrathin barrier laminates and methods of making the barrier assemblies are provided. A barrier assembly includes a thermoplastic polymer skin layer having opposite first and second major surfaces, and a barrier stack coated on the first major surface of the thermoplastic polymer skin layer to form an integral protective layer having a thickness no greater than about 0.5 mil (about 12.7 microns). The removable carrier film has a major surface releasably attached to the second major surface of the thermoplastic polymer skin layer. In some cases, the removal of the carrier film results in ultrathin barrier laminates.