THREE MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM

THREE MATERIAL HIGH K THERMAL ENCAPSULANT SYSTEM

Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MCMAHAN, Venmathy, ANANTHAKRISHNAN, Nisha, MALLIK, Amrita, NAGARAJAN, Sivakumar, WEINMAN, Craig J, EITAN, Amram, BOZORG-GRAYELI, Elah, CHU, Kuang-Han, WANG, Liwei
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Some embodiments relate to an electronic package. The electronic package includes a first die and a second die stacked onto the first die. A first encapsulant is positioned between the first die and the second die. The first encapsulant includes a first material that covers a first volume between the first die and the second die. A second encapsulant is positioned between the first die and the second die. The second encapsulant includes a second material that covers a second volume between the first die and the second die. The first material has a higher thermal conductivity than the second material, and the second material more effectively promotes electrical connections between the first die and the second die as compared to the first material.