A PROCESS FOR INTEGRATING THERMOSET AND THERMOPLASTIC POLYMERS

and cross-linking at least a portion of the epoxy compound with at least a portion of the PVDF-containing polymer, and in the same process step curing the epoxy resin system, to form a cured epoxy resin system having a cross-linked interface with a PVDF-containing polymer.

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Bibliographische Detailangaben
Hauptverfasser:	HEITZMANN, Michael, PATON, Rowan Johnson, VANDI, Luigi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	and cross-linking at least a portion of the epoxy compound with at least a portion of the PVDF-containing polymer, and in the same process step curing the epoxy resin system, to form a cured epoxy resin system having a cross-linked interface with a PVDF-containing polymer.