LAMINATED BODY COMPRISING METAL WIRE LAYER, AND MANUFACTURING METHOD THEREFOR

The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIN, Bo Ra, JEONG, Hye Won, KIM, Kyungjun, MYUNG, Ji Eun, SON, Yong Goo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a method for producing a metal wire embedded flexible substrate from a laminate structure. The laminate structure includes a carrier substrate, a debonding layer disposed on at least one surface of the carrier substrate and including a polyimide resin, a metal wiring layer disposed in contact with the debonding layer, and a flexible substrate layer disposed in contact with the metal wiring layer. The adhesion strength between the metal wiring layer and the flexible substrate layer is greater than that between the metal wiring layer and the debonding layer. According to the method of the present invention, the flexible substrate with the metal wiring layer can be easily separated from the carrier substrate even without the need for other processes, such as laser and light irradiation. The embedding of the metal wires in the flexible substrate layer decreases the sheet resistance of an electrode and can protect the metal wires from damage or disconnection even when the flexible substrate is deformed in shape.