DEVICE AND METHOD FOR COOLING A SEMICONDUCTOR ARRANGEMENT

The invention relates to a device (27) and a method for cooling a semiconductor arrangement (19). The semiconductor arrangement (19) can be, for example, part of an inverter circuit (18) for conversion of energy from a regenerative energy source (17) into an AC voltage for an AC voltage grid (16). T...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KELLER, Christian Bernhard, KOCUR, Michael, BRUECKNER, Thomas, JANNING, Joerg
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING QUANTITY OF HEAT MEASURING TEMPERATURE PHYSICS SEMICONDUCTOR DEVICES TESTING THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a device (27) and a method for cooling a semiconductor arrangement (19). The semiconductor arrangement (19) can be, for example, part of an inverter circuit (18) for conversion of energy from a regenerative energy source (17) into an AC voltage for an AC voltage grid (16). The device (27) comprises a cooling device (28) controllable by means of a control variable S for cooling the semiconductor arrangement (19). By means of a change-determining means, a temperature change value (DT) of a component temperature (TH) of the semiconductor arrangement (19) is determined. A control device (30) determines a change difference (”D) between the temperature change value (DT) and a change default value (DV). The change default value (DV) can be at least temporarily or always less than zero and describes a target temperature decrease of the component temperature (TH), which serves as a reference variable. The change difference (”D) as a control deviation can be transmitted to a regulator. The cooling capacity generated via the cooling device (48) is thus limited if the component temperature (TH) drops due to external influences.