SOLDER ALLOY AND PACKAGE STRUCTURE USING SAME

A solder alloy contains 0.5 mass% or more and 1.25 mass% or less of Sb, In which satisfies 5.5‰¤[In]‰¤5.50+1.06[Sb] in a case of 0.5‰¤[Sb]‰¤1.0; and 5.5‰¤[In]‰¤6.35+0.212[Sb] in a case of 1.0

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Bibliographische Detailangaben
Hauptverfasser:	HINE, Kiyohiro, FURUSAWA, Akio, KITAURA, Hidetoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A solder alloy contains 0.5 mass% or more and 1.25 mass% or less of Sb, In which satisfies 5.5‰¤[In]‰¤5.50+1.06[Sb] in a case of 0.5‰¤[Sb]‰¤1.0; and 5.5‰¤[In]‰¤6.35+0.212[Sb] in a case of 1.0