REFLOW OVEN LINER WITH A SUBSTRATE AND AN ADHESIVE LAYER, AND A METHOD OF TREATING THE SURFACE OF A REFLOW OVEN

A liner for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate having a length and a width defining an area. The substrate has a thickness defined by first and second sides. An adhesive is positioned on the first side of the substrate. The substrate is remov...

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Bibliographische Detailangaben
Hauptverfasser:	BAILEY, Elizabeth B, BLAIR, Paul M
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES BLASTING CHEMICAL PAINT OR INK REMOVERS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS,IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KINDOF FURNACE DYES FILLING PASTES FURNACES FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL HEATING INKS KILNS LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS OPEN SINTERING OR LIKE APPARATUS OVENS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES RETORTS SOLDERING OR UNSOLDERING TRANSPORTING USE OF MATERIALS THEREFOR WEAPONS WELDING WOODSTAINS WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A liner for contamination control in a reflow oven, which reflow oven has surfaces, includes a substrate having a length and a width defining an area. The substrate has a thickness defined by first and second sides. An adhesive is positioned on the first side of the substrate. The substrate is removably adhered to the surfaces of the reflow oven, and the liner is configured to accumulate solder reflow contaminants thereon or to repel solder flux vapors and/or fumes, and is configured for removal from the surfaces with any accumulated contaminants. A method of treating the surfaces of a reflow oven is also disclosed.