SELECTIVE FIN CUT

The present invention relates to the use of directed self-assembly for selectively removing at least one fin (440) or fin (440) section from a pattern (420) of parallel fins (440, 450) in a semiconductor structure.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MACHKAOUTSAN, Vladimir, GRONHEID, Roel
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention relates to the use of directed self-assembly for selectively removing at least one fin (440) or fin (440) section from a pattern (420) of parallel fins (440, 450) in a semiconductor structure.