SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME
There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper al...
Gespeichert in:
| Hauptverfasser: | , , , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KISHIBATA, Yuya TOYOIZUMI, Jyun SONODA, Yuta KONDO, Takaya SUGAWARA, Akira KOTANI, Hirotaka ENDO, Hideki NARIEDA, Hiroto |
| description | There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 µ m by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 µ m by electroplating using a tin-copper plating bath which contains 5 to 35 % by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 µ m or less by electroplating if necessary. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3293291B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3293291B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3293291B13</originalsourceid><addsrcrecordid>eNrjZDAM9lMI8HEM8fRzV_B1DHEN8nT0UXD0c1HwdQ3x8HdRcPMPUggI8ncJdQapCHb0deVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcZGlkBk6GRoTIQSAOtOJec</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME</title><source>esp@cenet</source><creator>KISHIBATA, Yuya ; TOYOIZUMI, Jyun ; SONODA, Yuta ; KONDO, Takaya ; SUGAWARA, Akira ; KOTANI, Hirotaka ; ENDO, Hideki ; NARIEDA, Hiroto</creator><creatorcontrib>KISHIBATA, Yuya ; TOYOIZUMI, Jyun ; SONODA, Yuta ; KONDO, Takaya ; SUGAWARA, Akira ; KOTANI, Hirotaka ; ENDO, Hideki ; NARIEDA, Hiroto</creatorcontrib><description>There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 µ m by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 µ m by electroplating using a tin-copper plating bath which contains 5 to 35 % by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 µ m or less by electroplating if necessary.</description><language>eng ; fre ; ger</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CURRENT COLLECTORS ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; LINE CONNECTORS ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230809&DB=EPODOC&CC=EP&NR=3293291B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230809&DB=EPODOC&CC=EP&NR=3293291B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KISHIBATA, Yuya</creatorcontrib><creatorcontrib>TOYOIZUMI, Jyun</creatorcontrib><creatorcontrib>SONODA, Yuta</creatorcontrib><creatorcontrib>KONDO, Takaya</creatorcontrib><creatorcontrib>SUGAWARA, Akira</creatorcontrib><creatorcontrib>KOTANI, Hirotaka</creatorcontrib><creatorcontrib>ENDO, Hideki</creatorcontrib><creatorcontrib>NARIEDA, Hiroto</creatorcontrib><title>SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME</title><description>There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 µ m by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 µ m by electroplating using a tin-copper plating bath which contains 5 to 35 % by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 µ m or less by electroplating if necessary.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAM9lMI8HEM8fRzV_B1DHEN8nT0UXD0c1HwdQ3x8HdRcPMPUggI8ncJdQapCHb0deVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcZGlkBk6GRoTIQSAOtOJec</recordid><startdate>20230809</startdate><enddate>20230809</enddate><creator>KISHIBATA, Yuya</creator><creator>TOYOIZUMI, Jyun</creator><creator>SONODA, Yuta</creator><creator>KONDO, Takaya</creator><creator>SUGAWARA, Akira</creator><creator>KOTANI, Hirotaka</creator><creator>ENDO, Hideki</creator><creator>NARIEDA, Hiroto</creator><scope>EVB</scope></search><sort><creationdate>20230809</creationdate><title>SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME</title><author>KISHIBATA, Yuya ; TOYOIZUMI, Jyun ; SONODA, Yuta ; KONDO, Takaya ; SUGAWARA, Akira ; KOTANI, Hirotaka ; ENDO, Hideki ; NARIEDA, Hiroto</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3293291B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>KISHIBATA, Yuya</creatorcontrib><creatorcontrib>TOYOIZUMI, Jyun</creatorcontrib><creatorcontrib>SONODA, Yuta</creatorcontrib><creatorcontrib>KONDO, Takaya</creatorcontrib><creatorcontrib>SUGAWARA, Akira</creatorcontrib><creatorcontrib>KOTANI, Hirotaka</creatorcontrib><creatorcontrib>ENDO, Hideki</creatorcontrib><creatorcontrib>NARIEDA, Hiroto</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KISHIBATA, Yuya</au><au>TOYOIZUMI, Jyun</au><au>SONODA, Yuta</au><au>KONDO, Takaya</au><au>SUGAWARA, Akira</au><au>KOTANI, Hirotaka</au><au>ENDO, Hideki</au><au>NARIEDA, Hiroto</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME</title><date>2023-08-09</date><risdate>2023</risdate><abstract>There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 µ m by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 µ m by electroplating using a tin-copper plating bath which contains 5 to 35 % by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 µ m or less by electroplating if necessary.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP3293291B1 |
| source | esp@cenet |
| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LINE CONNECTORS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-14T10%3A16%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KISHIBATA,%20Yuya&rft.date=2023-08-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3293291B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |