SN PLATING MATERIAL AND METHOD FOR PRODUCING SAME

There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper al...

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Bibliographische Detailangaben
Hauptverfasser:	KISHIBATA, Yuya, TOYOIZUMI, Jyun, SONODA, Yuta, KONDO, Takaya, SUGAWARA, Akira, KOTANI, Hirotaka, ENDO, Hideki, NARIEDA, Hiroto
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CURRENT COLLECTORS ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LINE CONNECTORS METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	There is provided a tin-plated product having an excellent minute sliding abrasion resistance property when it is used as the material of insertable and extractable connecting terminals, and a method for producing the same. After a nickel layer 16 is formed on a substrate 10 of copper or a copper alloy so as to have a thickness of 0.1 to 1.5 µ m by electroplating, a tin-copper plating layer 12 containing tin 12b mixed with a copper-tin alloy 12a is formed thereon so as to have a thickness of 0.6 to 10 µ m by electroplating using a tin-copper plating bath which contains 5 to 35 % by weight of copper with respect to the total amount of tin and copper, and then, a tin layer 14 is formed thereon so as to have a thickness of 1 µ m or less by electroplating if necessary.