EPOXY RESIN COMPOSITION, THERMOCONDUCTIVE MATERIAL PRECURSOR, B-STAGE SHEET, PREPREG, HEAT-DISSIPATING MATERIAL, LAMINATED PLATE, METAL SUBSTRATE, AND PRINTED CIRCUIT BOARD
Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crys...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition. |
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