ELECTROMAGNETIC INDUCTION-TYPE POSITION DETECTION SENSOR

Provided is a position detection sensor capable of maintaining accuracy even when loop coils are formed on a sheet-shaped board by thermal treatment using copper paste. The position detection sensor has a plurality of position detection loop coils formed on a sheet-shaped board made of polyimide-based resin through a thermal process by forming a wiring path pattern made of copper paste that includes copper powder and a binder through printing. On one face of the sheet-shaped board, the wiring path pattern made of the copper paste is formed to extend in a first direction, and the wiring path pattern formed to extend in the first direction is formed to extend in a second direction orthogonal to the first direction at a given pitch. On another face of the sheet-shaped board, the wiring path pattern made of the copper paste is formed to extend in the second direction, and the wiring path pattern formed to extend in the second direction is formed to extend in the first direction at a given pitch.