MEMS SENSOR COMPONENT

A MEMS sensor component with a reduced sensitivity to internal or external stress and small spatial dimensions is provided. The component comprises a MEMS chip arranged in a cavity below a cap and elastically mounted to a carrier substrate by a connection element in a flip-chip configuration.

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Bibliographische Detailangaben
1. Verfasser:	PAHL, Wolfgang
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	A MEMS sensor component with a reduced sensitivity to internal or external stress and small spatial dimensions is provided. The component comprises a MEMS chip arranged in a cavity below a cap and elastically mounted to a carrier substrate by a connection element in a flip-chip configuration.