SUBSTRATE HOLDING METHOD, SUBSTRATE HOLDING DEVICE, PROCESSING METHOD AND PROCESSING DEVICE

Fine suction grooves 7b for sucking a wafer W are provided in a holding surface 7a of a stage 7. The suction grooves 7b are divided into, for instance, nine suction regions 61A to 61I. The suction region 61I sucks a center portion of the circular wafer w. The suction regions 61A, 61B, 61C, 61D, 61E,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHIBATA Hidekazu, OBIKANE Tadashi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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