SUBSTRATE HOLDING METHOD, SUBSTRATE HOLDING DEVICE, PROCESSING METHOD AND PROCESSING DEVICE

SUBSTRATE HOLDING METHOD, SUBSTRATE HOLDING DEVICE, PROCESSING METHOD AND PROCESSING DEVICE

Fine suction grooves 7b for sucking a wafer W are provided in a holding surface 7a of a stage 7. The suction grooves 7b are divided into, for instance, nine suction regions 61A to 61I. The suction region 61I sucks a center portion of the circular wafer w. The suction regions 61A, 61B, 61C, 61D, 61E,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIBATA Hidekazu, OBIKANE Tadashi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Fine suction grooves 7b for sucking a wafer W are provided in a holding surface 7a of a stage 7. The suction grooves 7b are divided into, for instance, nine suction regions 61A to 61I. The suction region 61I sucks a center portion of the circular wafer w. The suction regions 61A, 61B, 61C, 61D, 61E, 61F, 61F and 61H suck a peripheral end portion of the circular wafer W. A gas is separately jetted to nine positions on the wafer W held by the stage 7, said nine positions corresponding to the suction regions 61A to 61I.