RESISTOR DEVICE AND MANUFACTURING METHOD THEREOF
The present invention provides a wafer resistor device and a manufacturing method thereof. The manufacturing method of the wafer resistor device comprises the following steps: a first cutting step of magnetically attracting a magnetic metal contact of the wafer resistor device to cut a resistive lay...
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| Hauptverfasser: | , , |
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The present invention provides a wafer resistor device and a manufacturing method thereof. The manufacturing method of the wafer resistor device comprises the following steps: a first cutting step of magnetically attracting a magnetic metal contact of the wafer resistor device to cut a resistive layer for a first time; a second step of magnetically attracting the magnetic metal contact of the wafer resistor device to cut the resistive layer for a second time. Through the above steps, each wafer resistor device is heading in the same direction during the cutting steps to allow the cutting marks to appear in the same position on each wafer resistor device to reduce the amount of variation of the resistance value of each resistor due to the cutting steps. |
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