SEMICONDUCTOR MODULE

A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MORI, Shogo, KATO, Naoki, WATANABE, Hiroki, SATO, Harumitsu, NISHIMURA, Koji, YUGUCHI, Hiroshi
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A semiconductor module includes a wiring substrate and two semiconductor devices mounted on the wiring substrate. The semiconductor module includes a housing having a rectangular frame body including four side walls. The housing includes a beam that bridges first side walls. A bus bar includes two end portions, upright portions each extending from one of the end portions in the thickness direction of an insulating substrate, bent portions each extending continuously with one of the upright portions, and an extension extending continuously with the bent portions. A section of the extension is embedded in the housing.