SOLDERING APPARATUS

An object of the invention is to provide a soldering apparatus that moves the soldering apparatus at a rapid speed while ensuring that molten solder does not spill to the outside of a jet nozzle. A semiconductor device disclosed in the present description includes a solder tank that stores the molten solder, a jetting mechanism that has the jet nozzle, which extends upwards from the solder tank toward a holding surface, and a pump, which pumps the molten solder stored in the solder tank, and that jets the molten solder from the jet nozzle toward the holding surface by the pump being driven, an XY-direction moving mechanism that moves the solder tank in an X-direction and a Y-direction, which are parallel to the holding surface, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank such that the molten solder does not spill to the outside of the jet nozzle, when the XY-direction moving mechanism is driven to move the solder tank in the X-direction and/or the Y-direction.