MODULATED THERMAL CONDUCTANCE THERMAL ENCLOSURE

MODULATED THERMAL CONDUCTANCE THERMAL ENCLOSURE

A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous mater...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KLEIN, Jeffrey Michael, EICKHOFF, Steven J
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY
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Beschreibung
Zusammenfassung:A thermal insulation device includes a first plate, a second plate formed to nest adjacent the first plate with a gap between the first and second plates, a porous material disposed in the gap between the plates, a sealing layer disposed between the first and second plates such that the porous material is sealed from ambient at a pressure less than ambient, and a vapor generating material disposed in the gap.