CONDUCTIVE LAMINATED BODY FOR TOUCH PANEL, AND METHOD FOR MANUFACTURING CONDUCTIVE LAMINATED BODY FOR TOUCH PANEL

A conductive laminate for a touch panel including: a substrate which is light-transmitting and includes one surface; an underlayer which is light-transmitting and is disposed on the one surface of the substrate; a first copper oxynitride layer which is disposed on a surface of the underlayer opposit...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO, Arifumi, YOSHINARI, Tomo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPUTING COUNTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DIGITAL DATA PROCESSING INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS PHYSICS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A conductive laminate for a touch panel including: a substrate which is light-transmitting and includes one surface; an underlayer which is light-transmitting and is disposed on the one surface of the substrate; a first copper oxynitride layer which is disposed on a surface of the underlayer opposite to a surface that is in contact with the substrate; a copper layer which is disposed on a surface of the first copper oxynitride layer opposite to a surface that is in contact with the underlayer; and a second copper oxynitride layer which is disposed on a surface of the copper layer opposite to a surface that is in contact with the first copper oxynitride layer.