A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE

In one embodiment, a method of manufacturing semiconductor devices including metallizations (e.g. a Re-Distribution Layer - RDL metallizations 10) includes: - providing a capping stack (141, 161, 142, 162) onto the metallizations (10), wherein the stack includes at least one nickel layer, - includin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Molgg, Michele, Scime', Fabio
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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