WOOD DERIVED MULTILAYER PRODUCT WITH INTEGRATED ELECTRIC CIRCUIT AND MANUFACTURING PROCESS

WOOD DERIVED MULTILAYER PRODUCT WITH INTEGRATED ELECTRIC CIRCUIT AND MANUFACTURING PROCESS

Wood derived multilayer glued or laminated product having an integrated electric circuit, comprising a paper layer and conducting elements of conductive ink deposited on said paper layer, said elements being suitable for forming an electric circuit and said paper layer has a rugosity inferior to 60...

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Bibliographische Detailangaben
Hauptverfasser: DINIZ DA FONSECA, Joana, BASTOS DA SILVA, Miguel António, FARIA RAMOS TAVARES, Neuza Patrícia, CARVALHO GOMES, João Manuel, RIBEIRO DA CRUZ, Paulo Jorge, PACHECO NEVES CARTEADO MENA, Pedro Miguel, MACIAS FERRA, João Miguel, DE MELO MAIA, Cristina Isabel, SILVESTRE MENDES PINTO DE MOURA, Bruna Gabriela, POÇAS GONÇALVES, José Joaquim, ROCHA FELGUEIRAS DE SOUSA NOGUEIRA, Miguel, PINTO LOPES, Jaime Rafael
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Beschreibung
Zusammenfassung:Wood derived multilayer glued or laminated product having an integrated electric circuit, comprising a paper layer and conducting elements of conductive ink deposited on said paper layer, said elements being suitable for forming an electric circuit and said paper layer has a rugosity inferior to 60 μm. The paper layer may be of kraft paper. The product may comprise one or more additional kraft paper layers, in particular having a hole for receiving electric components such that the top surface of product remains flat. The product may include a fibreboard substrate of MDF. The paper layer may be a decorative paper layer glued with the circuit facing the substrate. The manufacture process comprises depositing conductive ink elements on a paper layer having rugosity inferior to 60 μm for forming an electric circuit; and incorporating, by gluing or laminating, said paper layer into the multilayer product.