APPARATUSES AND METHODS FOR TRANSFERRING AND BONDING SUBSTRATES
A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a s...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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