APPARATUSES AND METHODS FOR TRANSFERRING AND BONDING SUBSTRATES

A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ORDWAY, David, Carlton, SCHNEIDER, Uwe, LONG, Michael, Devin
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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