APPARATUSES AND METHODS FOR TRANSFERRING AND BONDING SUBSTRATES

A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a s...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ORDWAY, David, Carlton, SCHNEIDER, Uwe, LONG, Michael, Devin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BANDAGES, DRESSINGS OR ABSORBENT PADS CONVEYING DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF,TUBULAR STRUCTURES OF THE BODY, E.G. STENTS FILTERS IMPLANTABLE INTO BLOOD VESSELS FIRST-AID KITS FOMENTATION HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES HUMAN NECESSITIES HYGIENE MEDICAL OR VETERINARY SCIENCE ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES PACKING PERFORMING OPERATIONS PROSTHESES STORING TRANSPORTING TREATMENT OR PROTECTION OF EYES OR EARS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method and apparatus for mechanically deforming a substrate assembly. The substrate assembly may be advanced in a machine direction at a first velocity toward a bonder apparatus. The bonder apparatus may rotate about an axis of rotation and include a support surface between each of a first and a second member. The first member and the second member may be separated by a repitch angle. The second member may be repositioned such that the first member and the second member are separated by a product angle. The first member may receive a leading portion and second member may receive a trailing portion of the substrate assembly and each member may rotate at the first velocity. The leading portion and the trailing portion are separated by a product arc length, which may be equal to a process product pitch. The substrate assembly may then undergo one or more processes such as bonding, cutting, and/or scoring.