EMBEDDED PACKAGE STRUCTURE

An embedded package structure (1, 3, 4, 5) includes an insulation substrate (10), a first conductive layer (12), a second conductive layer (13), an electronic component (11) and a passive component (15). The insulation substrate (10) has a first conductive via (103) and a second conductive via (104). The first conductive layer (12) is formed on a top surface (101) of the insulation substrate (10) and contacted with the first conductive via (103). The second conductive layer (13) is formed on a bottom surface (102) of the insulation substrate (10), and contacted with the second conductive via (104). The electronic component (11) is embedded within the insulation substrate (10). Moreover, plural conducting terminals (110) of the electronic components (11) are electrically connected with the first conductive layer (12) and the second conductive layer (13) through the first conductive via (103) and the second conductive via (104). The passive component (15) is located near a first side of the electronic component (11) and separated from the electronic component (11). The passive component (15) is at least partially embedded within the insulation substrate (10).