DEVICE FOR MACHINING MATERIAL BY MEANS OF LASER RADIATION

A device for machining material by means of laser radiation, including a focusing optics for focusing a laser beam onto a workpiece and an adjusting optics for adjusting the intensity distribution comprising at least two plate-shaped optical elements which are arranged one behind the other in the be...

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Bibliographische Detailangaben
Hauptverfasser:	RUDOLF, Andreas, SCHÖNLEBER, Martin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS BLASTING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING LIGHTING MACHINE TOOLS MECHANICAL ENGINEERING METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS SOLDERING OR UNSOLDERING STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR TRANSPORTING WEAPONS WELDING WORKING BY LASER BEAM WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A device for machining material by means of laser radiation, including a focusing optics for focusing a laser beam onto a workpiece and an adjusting optics for adjusting the intensity distribution comprising at least two plate-shaped optical elements which are arranged one behind the other in the beam path of the laser beam, which are rotatable relative to one another in the circumferential direction, and which each have a surface with a circular pattern of sector-shaped facets which, in the circumferential direction, are alternately inclined with respect to the respective plate plane.