SILICONE PRESSURE SENSITIVE ADHESIVES

The invention provides a process for the production of a pressure sensitive adhesive, comprising dissolving a particulate solid MQ silicone resin having a bulk density in the range 0.4-0.9 g/cm3 in a volatile solvent, and dissolving a polydiorganosiloxane having a viscosity of 0.1 to 40,000 Pa·s at...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	BROWN, Janelle L, COOK, Leon Neal, KELLEY, Elizabeth, THOMPSON, Stephanie, SUTTON, Lori Jean, MITCHELL, Timothy Paul, COOK, Julie Lyn
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The invention provides a process for the production of a pressure sensitive adhesive, comprising dissolving a particulate solid MQ silicone resin having a bulk density in the range 0.4-0.9 g/cm3 in a volatile solvent, and dissolving a polydiorganosiloxane having a viscosity of 0.1 to 40,000 Pa·s at 25° C. in the volatile solvent before, simultaneously with or after dissolving the solid MQ silicone resin. The process of the present invention allows the production of a pressure sensitive adhesive in a solvent different from the solvent in which the MQ silicone resin was prepared.