POLYMERIC SUBSTRATES WITH AN IMPROVED THERMAL EXPANSION COEFFICIENT AND A METHOD FOR PRODUCING THE SAME
A substrate and method for providing a thermoplastic composite having a fiberglass mat embedded within a thermoplastic polymer. The characteristics of the fiberglass mat combined with a thermal compression bonding method allow for a substantially improved and desirable thermal expansion coefficient...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A substrate and method for providing a thermoplastic composite having a fiberglass mat embedded within a thermoplastic polymer. The characteristics of the fiberglass mat combined with a thermal compression bonding method allow for a substantially improved and desirable thermal expansion coefficient over conventionally filled thermoplastic substrates or other fiberglass reinforced thermoplastics. |
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