POLYMERIC SUBSTRATES WITH AN IMPROVED THERMAL EXPANSION COEFFICIENT AND A METHOD FOR PRODUCING THE SAME

A substrate and method for providing a thermoplastic composite having a fiberglass mat embedded within a thermoplastic polymer. The characteristics of the fiberglass mat combined with a thermal compression bonding method allow for a substantially improved and desirable thermal expansion coefficient...

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Bibliographische Detailangaben
Hauptverfasser: BENNET, Greggory, S, CERNOHOUS, Jeffrey, Jacob, SARNSTROM, Todd, Richard, ZINS, Vance, Warren
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A substrate and method for providing a thermoplastic composite having a fiberglass mat embedded within a thermoplastic polymer. The characteristics of the fiberglass mat combined with a thermal compression bonding method allow for a substantially improved and desirable thermal expansion coefficient over conventionally filled thermoplastic substrates or other fiberglass reinforced thermoplastics.