HPF MOLDING MEMBER HAVING EXCELLENT DELAMINATION RESISTANCE AND MANUFACTURING METHOD THEREFOR

Provided are an hot press formed (HPF) article having excellent delamination resistance, and a method for manufacturing same. The present invention relates to an HPF article which has a melted aluminum plating layer formed on the surface of a base steel sheet and has excellent delamination resistanc...

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Bibliographische Detailangaben
Hauptverfasser:	SOHN, Il-Ryoung, BAE, Dae-Chul, KIM, Heung-Yun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Beschreibung
Zusammenfassung:	Provided are an hot press formed (HPF) article having excellent delamination resistance, and a method for manufacturing same. The present invention relates to an HPF article which has a melted aluminum plating layer formed on the surface of a base steel sheet and has excellent delamination resistance, wherein the base steel sheet comprises: 0.18-0.25% by weight of C; 0.1-1.0% by weight of Si; 0.9-1.5% by weight of Mn; 0.03% by weight or less of P; 0.01% by weight or less of S; 0.01-0.05% by weight of Al; 0.05-0.5% by weight of Cr; 0.01-0.05% by weight of Ti; 0.001-0.005% by weight of B; 0.009% by weight or less of N; and the balance Fe and other impurities, and wherein the plating layer consists of a soft diffusion layer and a hard alloy layer, the hard alloy layer having a tau layer irregularly and non-continuously dispersed and distributed on the inside thereof at 10% or more of the entire area fraction so that the difference in hardness between the alloy layer and the diffusion layer is 400 (Hv) or less.