SHEET FOR THERMAL BONDING AND SHEET FOR THERMAL BONDING WITH AFFIXED DICING TAPE

A sheet for thermal bonding which has a tensile modulus of 10-3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt% and which, when heated from 23°C to 400°C in the air at a heating rate of 10 °C/min and then examined by energy dispersive X-ray spectrometry, has a carbon...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIZAKA, Tsuyoshi, SUGO, Yuki, FUSUMADA, Mitsuaki, KAMAKURA, Nao
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A sheet for thermal bonding which has a tensile modulus of 10-3,000 MPa and contains fine metal particles in an amount in the range of 60-98 wt% and which, when heated from 23°C to 400°C in the air at a heating rate of 10 °C/min and then examined by energy dispersive X-ray spectrometry, has a carbon concentration of 15 wt% or less.