APPARATUS AND METHOD TO PROVIDE A THERMAL PARAMETER REPORT FOR A MULTI-CHIP PACKAGE

The present disclosure provides an apparatus comprising a multi-die package substrate, a plurality of dies mounted on the multi-die package substrate, and a power management unit to execute thermal management firmware to manage temperatures of the plurality of dies. The plurality of dies comprises a first die and a second die. The first die comprises a first plurality of cores to execute instructions and process data, a first plurality of integrated voltage regulators, the first plurality of integrated voltage regulators associated with respective cores of the first plurality of cores, a shared cache coupled to the first plurality of cores, and a first plurality of temperature sensors associated with the first plurality of cores to generate first temperature measurement data. The second die coupled to the first die over a bi-directional interconnect comprises a second temperature sensor integral to the second die to generate second temperature measurement data. The power management unit is to periodically read temperature values from the plurality of dies in accordance with a specified time period, including temperature values from the first plurality of temperature sensors, the second temperature sensor, and additional temperature values from additional dies of the plurality of dies, and process the temperature values to determine a thermal management result, wherein processing the temperature values includes determining a maximum temperature value. A clock frequency of one or more of the plurality of dies is to be reduced based, at least in part, on the thermal management result.