ALUMINIUM SOLDER ALLOY FREE FROM PRIMARY SI PARTICLES AND METHOD FOR PRODUCTION THEREOF

The invention relates to an ingot consisting of an aluminium solder alloy having in percentage by weight 4.5%≦Si≦12%; and optionally one or more of the following alloying constituents in percentage by weight: Ti≦0.2%, Fe≦0.8%, Cu≦0.3%, Mn≦0.10%, Mg≦2.0%, Zn_23 0.20%, Cr≦0.05%, with the remainder alu...

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Bibliographische Detailangaben
Hauptverfasser: DROSTE, Werner, KUHNKE, Katrin, JANSSEN, Hartmut, GRÜN, Gerd-Ulrich
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The invention relates to an ingot consisting of an aluminium solder alloy having in percentage by weight 4.5%≦Si≦12%; and optionally one or more of the following alloying constituents in percentage by weight: Ti≦0.2%, Fe≦0.8%, Cu≦0.3%, Mn≦0.10%, Mg≦2.0%, Zn_23 0.20%, Cr≦0.05%, with the remainder aluminium and unavoidable impurities, individually at most 0.05 wt %, in total at most 0.15 wt %, wherein boron is additionally provided as an alloying constituent, wherein the boron content is at least 100 ppm and the aluminium alloy is free from primary Si particles having a size of more than 20 μm. The invention further relates to an aluminium alloy product consisting of an aluminium alloy, to an ingot consisting of an aluminium alloy and to a method for producing an aluminium alloy.