A SCANNING MIRROR DEVICE AND A METHOD FOR MANUFACTURING IT

An optical device formed of a mirror wafer (200), a cap wafer (240), and a glass wafer (260). The mirror wafer includes a first layer of electrically conductive material (202), a second layer of electrically conductive material (204), and a third layer of electrically insulating material (206) betwe...

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Bibliographische Detailangaben
Hauptverfasser:	Laaksonen, Tapani, Torkkeli, Altti
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS TRANSPORTING
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Beschreibung
Zusammenfassung:	An optical device formed of a mirror wafer (200), a cap wafer (240), and a glass wafer (260). The mirror wafer includes a first layer of electrically conductive material (202), a second layer of electrically conductive material (204), and a third layer of electrically insulating material (206) between the first layer (202) and the second layer (204). A mirror element (208) is formed of the second layer (204) of the mirror wafer, and has a reflective surface (214) in the bottom of a cavity opened into at least the first layer. A good optical quality planar glass wafer (260) can be used to enclose the mirror element (208) when the mirror wafer (200), cap wafer (240), and glass wafer (260) are bonded to each other.